MediaTek has launched a new SoC in the 6000 series called the MediaTek Dimensity 6100+.
It had launched the Dimensity 6020 and 6080 earlier this year.
Features
The latest mid-tier 5G chip is aimed towards mainstream 5G devices, offering impressive power efficiency achieved through its 4nm-based manufacturing process.
It offers sub-6GHz 5G connectivity along with support for vibrant displays, high frame rates, AI-powered camera technologies and low power consumption.
5G capability
The embedded 5G model on the Dimensity 6100+ is compatible with low-band ENDC and 8-layer DL MIMO technologies.
It can utilize up to a maximum of 140MHz cellular spectrum to deliver up to 3.3Gbps download speeds via the 5G network.
Connectivity
It provides comprehensive connectivity options such as 5G Sub-6, Wi-Fi 6E, Bluetooth 5.3, GPS, and NFC for reliable connections.
Storage
Storage options include up to 1TB UFS 3.1 storage, and the SoC supports up to 16GB LPDDR5 RAM.
Camera
The SoC supports up to 200MP single camera or 3x 64MP cameras with its 2x 14-bit ISP.
Further, it comes with MediaTek’s AI-powered camera technologies which help enhance photography capabilities, allowing for advanced features and image enhancements.
Graphics
It features an octa-core CPU cluster with two high-performance 2.2GHz cores based on the Cortex-A76 architecture and six efficient 2.0GHz cores with Cortex-A55 architecture.
Graphics is handled by the Mali-G57 MC2 GPU, which can drive the display with up to a 120Hz refresh rate and FHD+ resolution.
Gaming
The Dimensity 6100+ SoC is equipped with MediaTek HyperEngine 5.0 gaming technology.
It provides optimized gaming performance along with a smooth gaming experience.
Availability
The chip is expected to make its debut in smartphones during the third quarter of 2023.
